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並前往https://www.semanticscholar.org/paper/Mold-Flow-Simulation-for-Fan-out-Panel-Level-Bu-Che/4e473d0ef71d913db10558ed5ec627e12bd8e0b4

Mold Flow Simulation for Fan-out Panel ... - Semantic Scholar

In order to achieve higher productivity and lower cost, Fan-out panel-level packaging (FOPLP) was developed recently to increase throughput ...

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