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並前往https://polymerinnovationblog.com/polymers-in-electronic-packaging-build-up-films-for-flip-chip-semiconductor-substrates-part-two/

Build-Up Films for Flip Chip Semiconductor Substrates, Part Two

Cross section of a 1+4+1 HDI substrate using Ajinomoto build-up film (ABF). The previous post discussed the geometry of the ABF products and ...

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