▫ 晶圓製造流程(Wafer Foundry). ▫ 晶圓測試流程(Wafer Probing). ▫ IC封裝流程 ... •晶粒切割(Wafer Saw). •黏晶(Die Attach). •焊線(Wire bond). •封膠(Molding). •化學 ...
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