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WLCSP-4-P8 | Packages | Nisshinbo Micro Devices

Package, WLCSP-4-P8. Pin, 4. Dimensions (mm), 0.64×0.64. Thickness (mm), 0.4. Pitch (mm), 0.35. Solder Ball (mm), 0.2. Plating, Sn2.5Ag.

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