你即將離開本站

並前往http://www.ncap-cn.com/en/tech/mid-end-wafer-level-packaging-technology/2094.html

Wafer Level Chip Scale Package

2P2M，Ball on RDL w/ UBM. Process Capabilities. WLCSP (8”and 12”). Max. Die Size: 6x6mm. Wafer Thickness: 12”, Min.300μm. Dielectric Material: PI/PBO.

確定！ 回上一頁

查詢 「WLCSP process flow」的人也找了：

  1. WLCSP package
    2.
  2. wlcsp是什麼
    3.
  3. wlcsp測試
    4.
  4. wlcsp封裝
    5.
  5. wafer level chip scale package中文
    6.
  6. InFO package process flow
    7.
  7. WLCSP package vs BGA
    8.
  8. FOWLP process flow
    9.