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並前往https://www.infineon.com/dgdl/Infineon-AN69061_Design_Manufacturing_and_Handling_Guidelines_for_Infineon_Wafer_Level_Chip_Scale_Packages-ApplicationNotes-v06_00-EN.pdf?fileId=8ac78c8c7cdc391c017d0735852058dd

AN69061 - Infineon Technologies

The following procedure is a recommended rework flow for an example reworkable underfill SUF1577-15: 1. Heat the WLCSP at 230–260 °C with a focused IR, hot air ...

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