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並前往https://indico.cern.ch/event/590645/contributions/2528102/attachments/1441098/2218655/TSV_LETI_RLB_2017.pdf

TSV development with CEA Leti in the FEI4 chip - CERN Indico

RDL design for FE-i4B. – Copper layer on back side of chips. – Large solder pad array compatible with direct laser soldering.

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