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並前往https://www.utacgroup.com/wp-content/uploads/2019/09/SunW_ICEPT08_Drop.pdf

Study of Five Substrate Pad Finishes for the Co ... - UTAC

Key words: pad finish, NiAu, OSP, SoP, Immersion Tin,. NiPdAu, solder joint reliability, IMC, ... should be noted that change of substrate solder pad finish.

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