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並前往https://nepp.nasa.gov/workshops/etw2020/talks/16-JUN-TUE/1430-Suh-NEPP-ETW-CL20-2804.pdf

Eric J Suh - NASA NEPP

C4 bump (~250µm pitch). • Organic substrate to die/interposer. 1) C4 bump. 2) Cu pillar bump (smaller pitch size than regular C4).

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