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並前往https://www.nxp.com/docs/en/application-note/AN2409.pdf

AN2409, Small Outline Integrated Circuit (SOIC) Package - NXP

Package Body Size (L). Package Height Max. Package Pitch. SOIC 8N. 8 ... of the solder mask along the pad-to-pad spacing so only the "toes" of the pads are.

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