Ptt 大爆卦 | molding compound封裝 - 前往 https://www.igroup.com.tw/wp-content/uploads/2018/07/%E6%B7%BA%E8%AB%87%E7%92%B0%E6%B0%A7%E6%A8%B9%E8%84%82%E5%9C%A8%E5%8D%8A%E5%B0%8E%E9%AB%94%E6%A7%8B%E8%A3%9D%E7%9A%84%E6%87%89%E7%94%A8%E8%88%87%E7%99%BC%E5%B1%95%E8%B6%A8%E5%8B%A2.pdf

你即將離開本站

並前往https://www.igroup.com.tw/wp-content/uploads/2018/07/%E6%B7%BA%E8%AB%87%E7%92%B0%E6%B0%A7%E6%A8%B9%E8%84%82%E5%9C%A8%E5%8D%8A%E5%B0%8E%E9%AB%94%E6%A7%8B%E8%A3%9D%E7%9A%84%E6%87%89%E7%94%A8%E8%88%87%E7%99%BC%E5%B1%95%E8%B6%A8%E5%8B%A2.pdf

淺談環氧樹脂在半導體構裝的應用與發展趨勢 - iGroup Taiwan

半導體封裝材料. • Underfill, CUP(Capillary underfill), Mold underfill. • Liquid Encapsulants. • Mold compounds. • 高導熱材料.

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