你即將離開本站

並前往https://www.qidyyt.co/epoxy-molding-compound%E4%B8%AD%E6%96%87/

epoxy molding compound中文 - B8bney

EMC (Epoxy Molding Compound) 半導體等級封裝環氧樹酯. Definition & Features. Composition: Epoxy Resin, Hardner, Filler (Silica), Some Additives.

確定！ 回上一頁

查詢 「molding compound封裝」的人也找了：

  1. molding compound中文
    2.
  2. molding compound成分
    3.
  3. molding compound廠商
    4.
  4. Molding Compound
    5.
  5. molding製程
    6.
  6. molding封膠
    7.
  7. 封裝材料環氧樹脂
    8.
  8. Epoxy Molding Compound
    9.