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並前往https://web.i-sim.org/conference/gcsi2012/Details/present/21-Present.pdf

Using TRIZ to Solve Lead Frame Delamination in ... - I-SIM

Solution: Make lead frame partially rippled possibly with holes to absorb stress from thermal expansion/contraction due to disparate CTE. 晶片. 模壓線. 導線架 ...

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