你即將離開本站

並前往https://www-old.mpi-halle.mpg.de/mpi/publi/pdf/782_99.pdf

Wafer direct bonding: tailoring adhesion between brittle ...

Wafers covered with a native oxide were contacted at room temperature; the thus bonded pair was annealed at 1000±. 11008C to induce covalent bonding and to ...

確定！ 回上一頁

查詢 「Wafer bonding」的人也找了：

  1. wafer bonding製程
    2.
  2. Wafer bonding
    3.
  3. Wafer-to-Wafer bonding
    4.
  4. wafer bonding中文
    5.
  5. Wafer Bonder
    6.
  6. Die-to-wafer bonding
    7.
  7. Wafer bonding technology
    8.
  8. Wafer bonder equipment
    9.