你即將離開本站

並前往https://www.mysciencework.com/patent/show/process-improvements-titaniumtungsten-etching-presence-electroplated-c4s-US6130170A

Process improvements for titanium-tungsten etching in the pres...

This method also uses a mask and forms solder bumps only at the selected ... In addition, the TiW layer cannot be undercut more than 4 .mu.m beneath the solder ...

確定！ 回上一頁

查詢 「Solder mask undercut」的人也找了：

  1. solder mask綠漆
    2.
  2. solder mask材料
    3.
  3. solder mask中文
    4.
  4. solder mask製程
    5.
  5. solder resist opening中文
    6.
  6. Solder mask opening
    7.
  7. solder mask opening意思
    8.
  8. solder mask厚度
    9.