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並前往http://csml9.pme.nthu.edu.tw/pdf/members/peng/Design,%20Fabrication%20and%20Comparison%20of%20LeadFree-Eutectic%20Solder%20Joint%20Reliability%20of%20Flip%20Chip%20Package.pdf

Design, Fabrication and Comparison of Lead-Free/Eutectic ...

The key factors that influence solder joint reliability include the geometry of the solder joints, underfill material, solder material, as well as package's ...

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