你即將離開本站

並前往https://ieeexplore.ieee.org/document/7968407/

An SiC-Based Half-Bridge Module With an Improved Hybrid ...

This paper proposes a SiC-based, half-bridge (HB) module with a hybrid packaging method. Such a module is based on printed circuit board ...

確定！ 回上一頁

查詢 「Packaging method」的人也找了：

  1. Package type
    2.
  2. Food package
    3.
  3. Tertiary packaging
    4.
  4. Packaging material
    5.
  5. Advantages of packaging
    6.
  6. Tertiary packaging 中文
    7.
  7. Function of packaging
    8.
  8. Pharmaceutical packaging
    9.