你即將離開本站

並前往https://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en597892

Package Material Content Declaration - Microchip Technology

Package Description. Lead Finish. J-STD-609 Category. Material. Substance. CAS #. Weight (mg). Percentage ppm. Percentage ppm. Leadframe. Copper (Cu).

確定！ 回上一頁

查詢 「Package material」的人也找了：

  1. Package material
    2.
  2. packaging中文
    3.
  3. Packaging type
    4.
  4. Packing material
    5.
  5. packaging materials中文
    6.
  6. Packaging material
    7.
  7. Packing method
    8.
  8. packing material中文
    9.