你即將離開本站

並前往https://iopscience.iop.org/article/10.1088/1742-6596/901/1/012090/pdf

Effecting aging time of epoxy molding compound ... - IOPscience

Encapsulation of epoxy molding compound (EMC) for molding process is a popular method for integrated circuit (IC) packaging manufacturing. Molding is the ...

確定！ 回上一頁

查詢 「Molding Compound」的人也找了：

  1. molding compound中文
    2.
  2. molding compound封裝
    3.
  3. molding compound製程
    4.
  4. molding compound廠商
    5.
  5. molding compound成分
    6.
  6. epoxy molding compound中文
    7.
  7. Sheet molding compound
    8.
  8. molding compound材料
    9.