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並前往https://resources.sw.siemens.com/zh-TW/white-paper-system-level-connectivity-management-and-verification-of-3d-ic-heterogeneous

3D IC 異質組裝的系統層級連線關係之管理與驗證

Capturing and verifying system-level connectivity in a multi-substrate 3D IC assembly using Xpedition Substrate Integrator and Calibre 3DSTACK.

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