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並前往https://www.cn.nctu.edu.tw/en/research/Conference_Papers/-span-lang-EN-US-style-font-family-quot-Arial-Unicode-MS-quot-quot-sans-serif-quot-mso-bidi-language-AR-SA-mso-ansi-language-EN-US-mso-fareast-language-ZH-TW-Chih-Wei-Chang-Po-Tsang-Huang-Lei-Chun-Chou-Shang-Lin-Wu-Shih-Wei-Lee-Ching-Te-Chuang-Kuan-Neng-Chen-b-Jin-Chern-Chiou-b-Wei-Hwang-Yen-Chi-Lee-Chung-Hsi-Wu-Kuo-Hua-Chen-Chi-Tsung-Chiu-and-Ho-Ming-Tong-quot-span-span-lang-EN-US-style-font-family-quot-Times-New-Roman-quot-quot-serif-quot-mso-fareast-font-family-%E6%96%B0%E7%B4%B0%E6%98%8E%E9%AB%94-mso-bidi-language-AR-SA-mso-ansi-language-EN-US-mso-fareast-language-ZH-TW-a-href-http-lpsoc-eic-nctu-edu-tw-pub-Through-Silicon-Via-Based-20Double-Side-20Integrated-20Microsystem-20for-20Neural-20Sensing-20Applications-pdf-span-style-font-family-quot-Arial-Unicode-MS-quot-quot-sans-serif-quot-color-windowtext-text-decoration-none-text-underline-none-Through-Silicon-Via-Based-Double-Side-Integrated-Microsystem-for-Neural-Sensing-Applications-span-a-span-span-lang-EN-US-style-font-family-quot-Arial-Unicode-MS-quot-quot-sans-serif-quot-mso-bidi-language-AR-SA-mso-ansi-language-EN-US-mso-fareast-language-ZH-TW-quot-i-u-2013-IEEE-International-Solid-State-Circuits-Conference-ISSCC-u-i-pp-102-103-San-Francisco-CA-February-17-21-2013-span-47747449

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