你即將離開本站

並前往https://sst.semiconductor-digest.com/2001/03/from-dicing-to-packing-examining-the-packaging-process/

From dicing to packing: Examining the packaging process

This article reviews the steps used to assemble an IC at a foundry: wafer dicing, die bonding, wire bonding, encapsulation, lead finish, marking, singulation/ ...

確定！ 回上一頁

查詢 「IC packaging process」的人也找了：

  1. ic package種類
    2.
  2. ic package中文
    3.
  3. IC package
    4.
  4. IC package design
    5.
  5. Potting process
    6.
  6. SOIC package
    7.
  7. Semiconductor packaging
    8.
  8. IC process
    9.