你即將離開本站

並前往https://cuvillier.de/uploads/preview/public_file/1519/9783869554334.pdf

Chapter 2 Reliability in Electronic Packaging - Cuvillier Verlag

2.1 shows typical processes undertaken to fabricate these plastic IC packages. In the first step, large wafers containing up to several semiconductor chips are ...

確定！ 回上一頁

查詢 「IC packaging process」的人也找了：

  1. ic package種類
    2.
  2. ic package中文
    3.
  3. IC package
    4.
  4. IC package design
    5.
  5. Potting process
    6.
  6. SOIC package
    7.
  7. Semiconductor packaging
    8.
  8. IC process
    9.