你即將離開本站

並前往https://patents.google.com/patent/US20070290376A1/en

US20070290376A1 - Integrated circuit (IC) package stacking ...

In an aspect of the invention, an IC package includes an IC die with contact ... Multistep manufacturing processes thereof all the devices being of a type ...

確定！ 回上一頁

查詢 「IC packaging process」的人也找了：

  1. ic package種類
    2.
  2. ic package中文
    3.
  3. IC package
    4.
  4. IC package design
    5.
  5. Potting process
    6.
  6. SOIC package
    7.
  7. Semiconductor packaging
    8.
  8. IC process
    9.