你即將離開本站

並前往https://eda.sw.siemens.com/en-US/ic-packaging/

Semiconductor packaging design & verification - Siemens EDA

Discover a comprehensive 2.5/3D IC packaging design solution for heterogeneous IC/chiplet integration utilizing an STCO IC packaging process methodology.

確定！ 回上一頁

查詢 「IC packaging process」的人也找了：

  1. ic package種類
    2.
  2. ic package中文
    3.
  3. IC package
    4.
  4. IC package design
    5.
  5. Potting process
    6.
  6. SOIC package
    7.
  7. Semiconductor packaging
    8.
  8. IC process
    9.