你即將離開本站

並前往https://www.sciencedirect.com/science/article/abs/pii/S0167931721000745

Reliability evaluation of ultra thin 3D-IC ... - Science Direct

An ultra-thin chip into a three-dimensional integrated circuit package is proposed. •. Coupling effect of the manufacture and subsequent ...

確定！ 回上一頁

查詢 「IC package」的人也找了：

  1. ic package種類
    2.
  2. IC package type
    3.
  3. IC package design
    4.
  4. ic封裝
    5.
  5. IC packaging process
    6.
  6. SOT package
    7.
  7. Package type
    8.
  8. SMD package
    9.