你即將離開本站

並前往https://www.journaljerr.com/index.php/JERR/article/download/17313/32228

Die Attach Process Robustness through Epoxy Pattern ...

Die Attach Process Robustness through Epoxy. Pattern Optimization for DFN Device. Jerome J. Dinglasan1* and Frederick Ray I. Gomez1.

確定！ 回上一頁

查詢 「Die attach epoxy」的人也找了：

  1. die attach製程
    2.
  2. Die attach adhesive
    3.
  3. die attach中文
    4.
  4. Die attach film thickness
    5.
  5. LOCTITE 導電膠
    6.
  6. Thermocompression bonding
    7.
  7. Palomar 3880 ii
    8.
  8. Solder Paste Die Attach
    9.