你即將離開本站

並前往https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-03-databook.pdf

Alumina & Leaded Molded Technology3 - Intel

For these packages Intel uses two categories of die attach adhesive materials: (1) adhesives, both ... filled organic adhesives, epoxy, and cyanate ester.

確定！ 回上一頁

查詢 「Die attach epoxy」的人也找了：

  1. die attach製程
    2.
  2. Die attach adhesive
    3.
  3. die attach中文
    4.
  4. Die attach film thickness
    5.
  5. LOCTITE 導電膠
    6.
  6. Thermocompression bonding
    7.
  7. Palomar 3880 ii
    8.
  8. Solder Paste Die Attach
    9.