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並前往https://www.microwavejournal.com/articles/951-integrated-passive-and-active-devices-using-csp-dfn-and-qfn-packaging-for-portable-electronic-applications

Integrated Passive and Active Devices Using CSP, DFN and ...

... DFN and QFN Packaging for Portable Electronic Applications ... wafer-level chip scale packaging (CSP), dual flat no-lead (DFN) or quad ...

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