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並前往https://www.semanticscholar.org/paper/Design-and-characterization-of-a-copper-pillar-flip-Lin-Gregorich/fb1de5a4f5fca2689d82a8529a640346521e051b

Design and characterization of a copper-pillar flip chip test ...

Overview Current solder-based flip chip technology is limited in ... small form-factor packages using 28nm ELK die and bump-on-trace (BOT).

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