2.5D/3D積體電路結合72.5mm x 70mm之大尺寸覆晶球柵陣列(2.5D/ 3D IC on 72.5mm x70mm large size FCBGA) ... 極薄型晶圓級晶片尺寸式封裝(Extremely-Thin WLCSP)
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