1. Base Material. Item, Polymide, Copper clad. One side, 0.5mil(12.5㎛), 1/3oz(12㎛)ED,RA,HTE · 2. Coverlay. Polymide, 접착제. 0.2mil ( 5㎛ ). 15㎛ ,20㎛. 0.3mil ...
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