LNP THERMOCOMP UF0067V is PPA base glass fiber filled compounds, good for LDS (Laser direct structuring) applications. Additional feature is high heat such ...
THERMOCOMP compounds enhance nearly any base resin for stiffness, heat resistance, dimensional tolerances - even specific gravity or processing parameters.
LNP THERMOCOMP UF0067V is PPA base glass fiber filled compounds, good for LDS (Laser direct structuring) applications. Additional feature is high heat such ...
LNP™ THERMOCOMP™ AM EC004EXAR1 by SABIC is a polyetherimide (PEI) resin containing 20% carbon fiber. It is designed to provide a wider process window and ...
